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School of Engineering

Equipment at JASMiN

ISE-OE-PVD-3000 DC and RF Magnetron Sputtering System

  • Used for deposition of metal, oxide and nitride thin film materials.
  • Wafer size: 2 or 3 inches
  • Target size: 2 inches

Cressington 108 auto sputter-coater

  • Used for routine sample preparation for scanning electron microscopy.
  • Target: gold


Karl Suss RC8 Spinner

  • Used for spin-on coating of photoresist materials and polymeric materials.
  • Distributes materials evenly across the surface of a substrate by spinning the substrate.
  • Wafer size: Up to 6 inches

Karl Suss MA 6 Double-side Mask Aligner

  • UV Mask aligner with double-sided capability used for photolithographically defining photoresist patterns onto substrates.
  • Wafer size: 6 inches

Chemical Wet Bench

  • Used for general chemical processing, such as wet chemical etching

Veeco Dektak3 ST Surface Profile Measurement System

  • Used to measure surface profile (sub micron) and film thickness (up to 262µm) after microfabrication steps.
  • Permits scans as long as 50mm with a maximum of 8,000 data points to determine accurate step heights and surface roughness.

HYBOND Model 572A-40 Wedge Bonder

  • Used for making wire connections onto finished devices.

Nikon Eclipse L150 Microscope

  • Used for optical characterization or observation of samples.
  • Capabilities: 5x, 20x, 50x, 100x extra long working distance Plan objectives; 6x6" XY stage; Brightfield, darkfield, differential interference, polarization illumination; Spot Insight color camera (1600x1200) image capture, feature measurement, documentation.

Micro Automation 1100 Wafer Dicing Saw

  • Microprocessor-controlled, programmable, automatic saw for cutting semiconductor wafers and other hard materials.
  • Closed circuit TV system with split image optics to align the wafers before cutting.
  • Wafer size: 6 inches

Agilent 4284 A Precision LCR Meter

  • Used for measurement of electrical properties.
  • Range: 20 Hz to 1 MHz with over with 8610 selectable test frequencies.

Karl Suss PM5 Analytical Probe System

  • Allows electrical probing of device under test.
  • Capabilities: Applying signals to individual die or wafers up to 8" diameter.
  • Currently used in conjunction with ETEC MMA.

MEMs Lab

The John A. Swanson Micro and Nanotechnology Laboratory is a premier research laboratory

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